「LODAS™ – AI50/100」

Features：

• For Photomask Blanks for Semiconductor Shipment Inspection, Process Evaluation
• Defect analysis by differential interference microscope
• Inspection target : Photomask Substrate, Cr, Resist, MoSi
• Inspection items : Particles, internal defects (Option)
• Inspection sensitivity: PDM defect size 0.1 μm (AI100)

「LODAS™ – BI8」

Features：

• Chromium, halftone, and resist films can be inspected.
• Automatic identification of white and black defects.
• Simultaneous inspection of not only surface defects, but also internal and backside defects.
• Four types of review images for defect analysis.
• “AI Classify” for defect classification and good/failure judgment.
• Maintenance free.
• World Primer! Hybrid inspection system using reflected scattered light, transmitted scattered light, and confocal light
• Inspecting for defects that have not been inspected before.

Target defect : Particles, Scratches, Pits, Voids

Specifications：

• Inspection Laser： 405nm 200mW Laser Diode
• Inspection Time：180sec
• Inspection Target：6inch　Photomask blanks
• Equipment Size：W×D×H＝450×500×730mm
• Utility: AC100V~200V 10A

「LODAS™ – BI12」

Features：

• For Glass wafer shipping inspection, process evaluation
• Simultaneous inspection of front, back and internal defects
• Determination and analysis of front and back surface defects using differential interference microscope
• Inspection target：12 inches, 8 inches, 6 inches, Glass wafer
• Inspection items :Particles on front and back surfaces, internal defects

「LODAS™ – CI8」

Features：

• Capable of inspecting both SiC single crystal wafers and epitaxial wafers.
• Simultaneous inspection of surface defects, internal defects, and backside defects.
• Four types of review images for defect analysis.
• “AI Classify” classifies defects and determines whether they are good or failure.
• Maintenance free.
• World Primer! Hybrid inspection system using reflected scattered light, transmitted scattered light, and confocal light.
• Inspecting for defects that have not been inspected before.

Target defect : Particles, Scratches, Crystal defects

Specifications：

• Inspection Laser： 405nm 200mW
• Inspection Time：200sec（size：4inch）
• Inspection Target：2 inches, 3 inches, 4 inches, 6 inches wafer
• Equipment Size：W×D×H＝450×500×730mm
• Utility: AC100V～200V　10A

「LODAS™ – LI series」

Features：

• Simultaneous A-side and B-side inspection.
• G10, G8, G6 sizes available
• Determination and analysis of front and back surface defects using differential interference microscope
• Inspection target :FPD Photomask Substrate、Cr、Resist Blanks
• Inspection items :Front and back surface particles, internal defects

「LODAS™ – BOIS」

Features：

• It can be used to inspect the results of various process scenes in accordance with the customer’s cleaning, polishing, and deposition equipment.
• Reduces processing time and costs by eliminating extra processing steps.
• Quality can be improved without installing inspection equipment, saving space and cost.
• The interface supports RS232C, IO, Ethernet, etc., and can be easily connected to peripheral devices.

Target defect : Particles, Scratches, Pits, etc.

Specifications：

• Inspection Laser： 405nm 200mW Laser Diode
• Inspection Sensitivity：100 nm PSL
• Inspection Target：Si wafer, compound semiconductor wafer, glass substrate, etc.
• Equipment Size：W×D×H＝250×200×500mm

Maintenance and repair of our inspection equipment

• Periodic support for maintaining performance immediately after equipment setup is complete.
• On-call service support. Open every day of the year. Phone number : 03-6451-4379
• We will respond to new requests sincerely.
• We will hold technical seminars and improve manuals so that customers can perform maintenance and parts replacement themselves.
• We will support you with free diagnosis service for consumables such as HDD and laser light source.